DT

Dirk Tobben

SA Siemens Aktiengesellschaft: 14 patents #607 of 22,248Top 3%
Infineon Technologies Ag: 12 patents #1,105 of 7,486Top 15%
IBM: 6 patents #16,453 of 70,183Top 25%
KT Kabushiki Kaisha Toshiba: 1 patents #13,537 of 21,451Top 65%
📍 Fishkill, NY: #26 of 387 inventorsTop 7%
🗺 New York: #4,427 of 115,490 inventorsTop 4%
Overall (All Time): #140,051 of 4,157,543Top 4%
28
Patents All Time

Issued Patents All Time

Showing 26–28 of 28 patents

Patent #TitleCo-InventorsDate
5899736 Techniques for forming electrically blowable fuses on an integrated circuit Peter Weigand 1999-05-04
5880007 Planarization of a non-conformal device layer in semiconductor fabrication Kathryn H. Varian, Matthew Sendelbach 1999-03-09
5854126 Method for forming metallization in semiconductor devices with a self-planarizing material Bruno Spuler, Martin Gutsche, Peter Weigand 1998-12-29