Issued Patents All Time
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10812665 | Information transmitting apparatus, multifunctional peripheral, information transmitting method, and non-transitory recording medium | Yuichi Nishii, Miyoko Maruyama | 2020-10-20 |
| 7474386 | Wafer flatness evaluation method, wafer flatness evaluation apparatus carrying out the evaluation method, wafer manufacturing method using the evaluation method, wafer quality assurance method using the evaluation method, semiconductor device manufacturing method using the evaluation method and semiconductor device manufacturing method using a wafer evaluated by the evaluation method | Tadahito Fujisawa, Soichi Inoue, Makoto Kobayashi, Tsuneyuki Hagiwara, Kenichi Kodama | 2009-01-06 |
| 7365830 | Wafer flatness evaluation method, wafer flatness evaluation apparatus carrying out the evaluation method, wafer manufacturing method using the evaluation method, wafer quality assurance method using the evaluation method, semiconductor device manufacturing method using the evaluation method and semiconductor device manufacturing method using a wafer evaluated by the evaluation method | Tadahito Fujisawa, Soichi Inoue, Makoto Kobayashi, Tsuneyuki Hagiwara, Kenichi Kodama | 2008-04-29 |
| 7276427 | Method for manufacturing SOI wafer | Takeshi Kobayashi, Miho Iwabuchi | 2007-10-02 |
| 7230680 | Wafer flatness evaluation method, wafer flatness evaluation apparatus carrying out the evaluation method, wafer manufacturing method using the evaluation method, wafer quality assurance method using the evaluation method, semiconductor device manufacturing method using the evaluation method and semiconductor device manufacturing method using a wafer evaluated by the evaluation method | Tadahito Fujisawa, Soichi Inoue, Makoto Kobayashi, Tsuneyuki Hagiwara, Kenichi Kodama | 2007-06-12 |
| 7203559 | Method for manufacturing semiconductor wafer, method for receiving order for manufacture of semiconductor wafer, and system for receiving order for manufacture of semiconductor wafer | Tatsuo Ito, Shigeyoshi Netsu, Nobuhiro Ohara | 2007-04-10 |
| 6294228 | Method for forming thin films | — | 2001-09-25 |
| 6048792 | Method for manufacturing an interconnection structure in a semiconductor device | Kenji Watanabe | 2000-04-11 |
| 5047608 | Method and apparatus for resistance welding wherein the electrode axis is included with respect to the electrode forcing axis | Yasuo Takahashi, Tohru Saito, Tadayuki Otani, Kunihiro Hayashida | 1991-09-10 |
| 4561561 | Container having an easy opening end with a tab affixed by ultrasonic welding | Yasuo Takahashi, Tohru Saito | 1985-12-31 |
| 4506134 | Flash butt welding method | Toru Saito, Takeshi Nishi | 1985-03-19 |