Issued Patents All Time
Showing 26–46 of 46 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6907867 | Control apparatus and control method for internal combustion engine | Osamu Igarashi, Koichi Akita, Shoji Sasaki | 2005-06-21 |
| 6883324 | Control apparatus and control method for internal combustion engine | Osamu Igarashi, Koichi Akita, Shoji Sasaki | 2005-04-26 |
| 6770666 | Fused-ring compounds and use thereof as drugs | Kenji Mizutani, Atsuhito Yoshida | 2004-08-03 |
| 6729941 | Process for manufacturing semiconductor wafer and semiconductor wafer | Junichi Ueno, Hisashi Masumura | 2004-05-04 |
| 6362209 | Heterocyclic aromatic oxazole compounds and use thereof | Junichi Haruta, Mutsuyoshi Matsushita | 2002-03-26 |
| 6002014 | Oxazole derivatives and use thereof | Junichi Haruta, Mutsuyoshi Matsushita | 1999-12-14 |
| 5994381 | Heterocyclic aromatic oxazole compounds and use thereof | Junichi Haruta, Mutsuyoshi Matsushita | 1999-11-30 |
| 5945539 | Oxazole derivatives and use thereof | Junichi Haruta, Mutsuyoshi Matsushita | 1999-08-31 |
| 5941209 | Fuel injection apparatus and method for direct injection type engines | — | 1999-08-24 |
| 5924405 | Apparatus and method for injecting fuel in cylinder injection type engines | — | 1999-07-20 |
| 5788560 | Backing pad and method for polishing semiconductor wafer therewith | Kenji Kasai, Taichi Ichikawa, Yuji Kawaura | 1998-08-04 |
| 5718620 | Polishing machine and method of dissipating heat therefrom | Kohichi Tanaka, Fumio Suzuki | 1998-02-17 |
| 5584746 | Method of polishing semiconductor wafers and apparatus therefor | Kouichi Tanaka, Fumio Suzuki | 1996-12-17 |
| 5564965 | Polishing member and wafer polishing apparatus | Kouichi Tanaka, Fumio Suzuki | 1996-10-15 |
| 5549502 | Polishing apparatus | Kohichi Tanaka, Yasuo Inada, Makoto Nakajima | 1996-08-27 |
| 5400547 | Polishing machine and method of dissipating heat therefrom | Kohichi Tanaka, Fumio Suzuki | 1995-03-28 |
| 5335457 | Method of chucking semiconductor wafers | Akira Matsuda, Shigeki Shudo, Noboru Shimamoto, Kohichi Tanaka, Fumio Suzuki | 1994-08-09 |
| 5333413 | Automatic wafer lapping apparatus | — | 1994-08-02 |
| 5174067 | Automatic wafer lapping apparatus | Fumihiko Hasegawa | 1992-12-29 |
| 5157877 | Method for preparing a semiconductor wafer | — | 1992-10-27 |
| 5101602 | Foam backing for use with semiconductor wafers | — | 1992-04-07 |