Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10483239 | Semiconductor device including dual pad wire bond interconnection | Junrong Yan, Xiaofeng Di, Harjashan Veer Singh, Gokul Kumar, Chee Keong Chin +1 more | 2019-11-19 |