YP

Young-kyou Park

Samsung: 13 patents #10,425 of 75,807Top 15%
📍 Seoul, KR: #4,477 of 39,741 inventorsTop 15%
Overall (All Time): #387,983 of 4,157,543Top 10%
13
Patents All Time

Issued Patents All Time

Showing 1–13 of 13 patents

Patent #TitleCo-InventorsDate
7268853 Exposing systems providing post exposure baking and related methods Sung-Jae Ryu, Sang-Kap Kim, Yoon-Ho Eo 2007-09-11
7208878 Method of manufacturing a rotation-magnetron-in-magnetron (RMIM) electrode Jai-kwang Shin, Seong-gu Kim, Hyeon-ill Um 2007-04-24
7119489 Rotation-magnetron-in-magnetron (RMIM) electrode, method of manufacturing the RMIM electrode, and sputtering apparatus including the RMIM electrode Jai-kwang Shin, Seong-gu Kim, Hyeon-ill Um 2006-10-10
7109132 High density plasma chemical vapor deposition process Jai-Hyung Won 2006-09-19
6953739 Method for manufacturing a semiconductor device having hemispherical grains at very low atmospheric pressure using first, second, and third vacuum pumps Chang-jip Yang, Chan Hee HAN, Jae Wook Kim 2005-10-11
6723215 Sputtering apparatus for forming a metal film using a magnetic field Hyeon-ill Um, Jai-kwang Shin, Seong-gu Kim 2004-04-20
6683010 Method for forming silicon-oxynitride layer on semiconductor device Baek-gyun Lim, Eu-seok Kim, Chang-jip Yang 2004-01-27
6673673 Method for manufacturing a semiconductor device having hemispherical grains Chang-jip Yang, Chan Hee HAN, Jae Wook Kim 2004-01-06
6312987 Method for manufacturing semiconductor device having hemispherical grain polysilicon film Chan Hee HAN, Young Ho Kang, Chang-jip Yang 2001-11-06
6090188 Air intake apparatus of chemical vapor deposition equipment and method for removing ozone using the same Chang-jip Yang, Geun-mok Youk, Chong-hyeong Cho 2000-07-18
6074486 Apparatus and method for manufacturing a semiconductor device having hemispherical grains Chang-jip Yang, Chan Hee HAN, Jae Wook Kim 2000-06-13
5842690 Semiconductor wafer anchoring device Che Lee, Seok-Jun Lee 1998-12-01
5821152 Methods of forming hemispherical grained silicon electrodes including multiple temperature steps Chan Hee HAN, Chang-jip Yang, Jae Wook Kim 1998-10-13