Issued Patents All Time
Showing 1–22 of 22 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12341086 | Lead frame | Dong Jin Yoon, In Seob BAE, Seok Kyu SEO, Dong Young Pyeon | 2025-06-24 |
| 11876012 | Method of manufacturing semiconductor package substrate and semiconductor package substrate manufactured using the same | In Seob BAE, Jea Won Kim | 2024-01-16 |
| 11854830 | Method of manufacturing circuit board | Dong Jin Yoon, In Seob BAE | 2023-12-26 |
| 11227775 | Method of fabricating carrier for wafer level package by using lead frame | Dong Young Pyeon, Jong Hoe Ku, In Seob BAE | 2022-01-18 |
| 10910299 | Method of manufacturing semiconductor package substrate and semiconductor package substrate manufactured using the method, and method of manufacturing semiconductor package and semiconductor package manufactured using the method | In Seob BAE, Dong Jin Yoon | 2021-02-02 |
| 10840170 | Semiconductor package substrate and method for manufacturing same | In Seob BAE | 2020-11-17 |
| 10643932 | Semiconductor package substrate and method for manufacturing same | In Seob BAE | 2020-05-05 |
| 10643933 | Semiconductor package substrate and manufacturing method therefor | In Seob BAE | 2020-05-05 |
| 9598220 | Cosmetic container with different types of mixed materials | Joon Young Kim, Oh Soo Lee | 2017-03-21 |
| 9460986 | Method of manufacturing semiconductor package substrate with limited use of film resist and semiconductor package substrate manufactured using the same | In Seob BAE, Min Seok Jin | 2016-10-04 |
| 8409726 | Printed circuit board with multiple metallic layers and method of manufacturing the same | Chang-han Shim, Se-chuel Park | 2013-04-02 |
| 8354741 | Lead frame manufactured from low-priced material and not requiring strict process control, semiconductor package including the same, and method of manufacturing the lead frame and the semiconductor package | Chang-han Shim | 2013-01-15 |
| 8278564 | Circuit board viaholes and method of manufacturing the same | Chang-han Shim, Se-chuel Park | 2012-10-02 |
| 8110505 | Lead frame manufactured from low-priced material and not requiring strict process control, semiconductor package including the same, and method of manufacturing the lead frame and the semiconductor package | Chang-han Shim | 2012-02-07 |
| 7454539 | Method for transferring variable isochronous data and apparatus therefore | Yoon Lee | 2008-11-18 |
| 7285845 | Lead frame for semiconductor package | Se-chuel Park | 2007-10-23 |
| 7155543 | Method for transferring variable isochronous data and apparatus therefor | Yoon Lee | 2006-12-26 |
| 6667987 | Method of extending channels for IEEE-1394 serial bus | Min-jee Kwon | 2003-12-23 |
| 6611886 | Method for transferring variable isochronous data and apparatus therefor | Yoon Lee | 2003-08-26 |
| 6475646 | Lead frame and method of manufacturing the lead frame | Se-chul Park, Dong Il Shin, Sang Hoon Lee, Bae-soon Jang | 2002-11-05 |
| 6469386 | Lead frame and method for plating the same | Kyu Han Lee, Sang Hun Lee, Se-chul Park | 2002-10-22 |
| 6150713 | Lead frame for semiconductor package and lead frame plating method | Se-chul Park, Kyu Han Lee, Ju Bong KIM, Dong Il Shin, Bae-soon Jang | 2000-11-21 |