Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12327728 | Method for manufacturing a pre-mold substrate | In Seob BAE, Kwang Jae Yoo | 2025-06-10 |
| 12249571 | Pre-mold substrate and method of manufacturing pre-mold substrate | Kwang Jae Yoo, In Seob BAE | 2025-03-11 |
| 11227775 | Method of fabricating carrier for wafer level package by using lead frame | Dong Young Pyeon, Sung-il Kang, In Seob BAE | 2022-01-18 |