Issued Patents All Time
Showing 1–14 of 14 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12341086 | Lead frame | Dong Jin Yoon, Sung-il Kang, Seok Kyu SEO, Dong Young Pyeon | 2025-06-24 |
| 12327728 | Method for manufacturing a pre-mold substrate | Jong Hoe Ku, Kwang Jae Yoo | 2025-06-10 |
| 12249571 | Pre-mold substrate and method of manufacturing pre-mold substrate | Kwang Jae Yoo, Jong Hoe Ku | 2025-03-11 |
| 11876012 | Method of manufacturing semiconductor package substrate and semiconductor package substrate manufactured using the same | Sung-il Kang, Jea Won Kim | 2024-01-16 |
| 11854830 | Method of manufacturing circuit board | Dong Jin Yoon, Sung-il Kang | 2023-12-26 |
| 11227775 | Method of fabricating carrier for wafer level package by using lead frame | Dong Young Pyeon, Sung-il Kang, Jong Hoe Ku | 2022-01-18 |
| 10910299 | Method of manufacturing semiconductor package substrate and semiconductor package substrate manufactured using the method, and method of manufacturing semiconductor package and semiconductor package manufactured using the method | Sung-il Kang, Dong Jin Yoon | 2021-02-02 |
| 10840170 | Semiconductor package substrate and method for manufacturing same | Sung-il Kang | 2020-11-17 |
| 10840161 | Method for manufacturing semiconductor package substrate | Hyeok Jin Jeon | 2020-11-17 |
| 10811302 | Method of manufacturing semiconductor package substrate and semiconductor package substrate manufactured using the same | Sung II Kang, Jea Won Kim | 2020-10-20 |
| 10643932 | Semiconductor package substrate and method for manufacturing same | Sung-il Kang | 2020-05-05 |
| 10643933 | Semiconductor package substrate and manufacturing method therefor | Sung-il Kang | 2020-05-05 |
| 9460986 | Method of manufacturing semiconductor package substrate with limited use of film resist and semiconductor package substrate manufactured using the same | Sung-il Kang, Min Seok Jin | 2016-10-04 |
| 9171789 | Lead frame, semiconductor package including the lead frame, and method of manufacturing the lead frame | Dong Il Shin, Se-chuel Park | 2015-10-27 |