Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11876012 | Method of manufacturing semiconductor package substrate and semiconductor package substrate manufactured using the same | Sung-il Kang, In Seob BAE | 2024-01-16 |
| 11139220 | Flexible semiconductor package formed by roll-to-roll process | Chong H. Park, Jong Woo Park | 2021-10-05 |
| 10811302 | Method of manufacturing semiconductor package substrate and semiconductor package substrate manufactured using the same | Sung II Kang, In Seob BAE | 2020-10-20 |