SK

Sung II Kang

HC Haesung Ds Co.: 1 patents #18 of 40Top 45%
Overall (All Time): #2,822,026 of 4,157,543Top 70%
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Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
10811302 Method of manufacturing semiconductor package substrate and semiconductor package substrate manufactured using the same In Seob BAE, Jea Won Kim 2020-10-20