Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8409726 | Printed circuit board with multiple metallic layers and method of manufacturing the same | Sung-il Kang, Se-chuel Park | 2013-04-02 |
| 8354741 | Lead frame manufactured from low-priced material and not requiring strict process control, semiconductor package including the same, and method of manufacturing the lead frame and the semiconductor package | Sung-il Kang | 2013-01-15 |
| 8319340 | Lead frame and method of manufacturing the same | Sung-kwan Paek | 2012-11-27 |
| 8278564 | Circuit board viaholes and method of manufacturing the same | Sung-il Kang, Se-chuel Park | 2012-10-02 |
| 8110505 | Lead frame manufactured from low-priced material and not requiring strict process control, semiconductor package including the same, and method of manufacturing the lead frame and the semiconductor package | Sung-il Kang | 2012-02-07 |