Issued Patents All Time
Showing 26–40 of 40 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7924592 | Semiconductor memory device having improved voltage transmission path and driving method thereof | Sun-Won Kang | 2011-04-12 |
| 7893526 | Semiconductor package apparatus | Sung-Ho MUN, Sun-Won Kang | 2011-02-22 |
| 7884458 | Decoupling capacitor, wafer stack package including the decoupling capacitor, and method of fabricating the wafer stack package | Sun-Won Kang | 2011-02-08 |
| 7851256 | Method of manufacturing chip-on-chip semiconductor device | Hyun-Soo Chung, Dong-Ho Lee, Seong-Deok Hwang, Sun-Won Kang | 2010-12-14 |
| 7767576 | Wafer level package having floated metal line and method thereof | Hyun-Soo Chung, Ju-Il Choi, Dong-Ho Lee | 2010-08-03 |
| 7759716 | Semiconductor device, method of fabricating the same, stacked module including the same, card including the same, and system including the stacked module | Sun-Won Kang | 2010-07-20 |
| 7663903 | Semiconductor memory device having improved voltage transmission path and driving method thereof | Sun-Won Kang | 2010-02-16 |
| 7652383 | Semiconductor package module without a solder ball and method of manufacturing the semiconductor package module | Sun-Won Kang, Dong-Ho Lee, Jong-Joo Lee, Sang Wook Park | 2010-01-26 |
| 7595559 | Integrated circuit chip having pass-through vias therein that extend between multiple integrated circuits on the chip | — | 2009-09-29 |
| 7586182 | Packaged semiconductor die and manufacturing method thereof | Sun-Won Kang, Sang Wook Park, Dong-Ho Lee, Jong-Joo Lee | 2009-09-08 |
| 7537959 | Chip stack package and manufacturing method thereof | Kang-Wook Lee, Gu-Sung Kim, Dong-Hyeon Jang, Jae-Sik Chung | 2009-05-26 |
| 7508061 | Three-dimensional semiconductor module having multi-sided ground block | Sun-Won Kang | 2009-03-24 |
| 7307340 | Wafer-level electronic modules with integral connector contacts | Dong-Hyeon Jang, Gu-Sung Kim, Kang-Wook Lee, Jae-Sik Chung | 2007-12-11 |
| 7276799 | Chip stack package and manufacturing method thereof | Kang-Wook Lee, Gu-Sung Kim, Dong-Hyeon Jang, Jae-Sik Chung | 2007-10-02 |
| 7274097 | Semiconductor package including redistribution pattern and method of manufacturing the same | Dong-Hyeon Jang, Jong-Joo Lee | 2007-09-25 |