MK

Min-ha Kim

Samsung: 43 patents #2,389 of 75,807Top 4%
RU Research & Business Foundation Sungkyunkwan University: 1 patents #708 of 1,975Top 40%
Overall (All Time): #67,450 of 4,157,543Top 2%
44
Patents All Time

Issued Patents All Time

Showing 26–44 of 44 patents

Patent #TitleCo-InventorsDate
7662202 Dust collector of vacuum cleaner Jang-keun Oh, Seoung-yun Seol, Kwang Su Heo 2010-02-16
7631394 Suction brush for vacuum cleaner Jang-keun Oh, Dong-houn Yang 2009-12-15
7604674 Dust separating apparatus Jung-gyun Han, Jang-keun Oh 2009-10-20
7594943 Cyclone dust separating apparatus Jang-keun Oh, Jung-Guyn Han, Hak-bong Lee 2009-09-29
7582129 Multi-cyclone dust separating apparatus Jung-gyun Han, Jang-keun Oh 2009-09-01
7562414 Dust sensing unit for use in vacuum cleaner Jang-keun Oh, Jin-gon Lee, Jung-gyun Han, Seung-Yong Cha 2009-07-21
7559965 Cyclonic separating apparatus for vacuum cleaner which is capable of separately collecting water from dust Jang-keun Oh 2009-07-14
7547338 Multi dust-collecting apparatus Jung-gyun Han, Jang-keun Oh 2009-06-16
7470299 Multi-cyclone dust separator and a vacuum cleaner using the same Jung-gyun Han, Jang-keun Oh 2008-12-30
7462212 Cyclone dust separating apparatus for vacuum cleaner and vacuum cleaner having the same Jung-gyun Han, Jang-keun Oh 2008-12-09
7381247 Cyclone dust collecting device for vacuum cleaner Jung-gyun Han, Jang-keun Oh 2008-06-03
7381233 Dust collecting apparatus for vacuum cleaner Jang-keun Oh 2008-06-03
7381248 Cyclone dust-separating apparatus with discharge electrodes Jung-gyun Han, Jang-keun Oh 2008-06-03
7258808 High-power ball grid array package, heat spreader used in the BGA package and method for manufacturing the same Heung-Kyu Kwon, Tae-Je Cho 2007-08-21
7078800 Semiconductor package Heung-Kyu Kwon, Se-Yong Oh, Tae-Je Cho 2006-07-18
6952050 Semiconductor package Heung-Kyu Kwon, Se-Yong Oh, Tae-Je Cho 2005-10-04
6781849 Multi-chip package having improved heat spread characteristics and method for manufacturing the same Joong-Hyun Baek, Tae-koo Lee, Yun-Hyeok Im 2004-08-24
6498388 Semiconductor module with improved solder joint reliability Joong-Hyun Baek 2002-12-24
6498395 Heat sink with cooling fins for semiconductor package Joong-Hyun Baek 2002-12-24