Issued Patents All Time
Showing 126–150 of 154 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7056776 | Semiconductor devices having metal containing N-type and P-type gate electrodes and methods of forming the same | Seong-Geon Park, Sang-Bom Kang, You-Kyoung Lee | 2006-06-06 |
| 7051934 | Methods of forming metal layers in integrated circuit devices using selective deposition on edges of recesses | Hyo-Jong Lee, Seung-Man Choi, Sang-Bum Kang | 2006-05-30 |
| 7045842 | Integrated circuit devices having self-aligned contact structures | Hee-Sook Park, Sang-Bom Kang, Kwang-Jin Moon, Hyun-Su Kim, Seung-Gil Yang | 2006-05-16 |
| 6955983 | Methods of forming metal interconnections of semiconductor devices by treating a barrier metal layer | Ju-Young Yun, Byung-Hee Kim, Jong-Myeong Lee, Seung-Gil Yang, Jung-Hun Seo | 2005-10-18 |
| 6951814 | Methods for forming a metal wiring layer on an integrated circuit device at reduced temperatures | Byung-Hee Kim, Ju-Young Yun, Jung-Hun Seo | 2005-10-04 |
| 6893915 | Semiconductor device having barrier layer between ruthenium layer and metal layer and method for manufacturing the same | Hee-Sook Park, Seung Hwan Lee, Yun-Jung Lee | 2005-05-17 |
| 6876078 | Semiconductor interconnection structure with TaN and method of forming the same | Byung-Hee Kim, Kyung-In Choi | 2005-04-05 |
| 6849555 | Wafer processing apparatus and wafer processing method using the same | Jong-Myeong Lee, Byung-Hee Kim, Myoung-Bum Lee, Ju-Young Yun | 2005-02-01 |
| 6821572 | Method of cleaning a chemical vapor deposition chamber | Kwang-Jin Moon, Sang-Bum Kang, Hee-Sook Park | 2004-11-23 |
| 6815285 | Methods of forming dual gate semiconductor devices having a metal nitride layer | Jong Ho Lee, Kyung-In Choi, Byung-Hee Kim | 2004-11-09 |
| 6787460 | Methods of forming metal layers in integrated circuit devices using selective deposition on edges of recesses and conductive contacts so formed | Hyo-Jong Lee, Seung-Man Choi, Sang-Bum Kang | 2004-09-07 |
| 6787468 | Method of fabricating metal lines in a semiconductor device | Byung-Hee Kim, Jong-Myeong Lee, Myoung-Bum Lee | 2004-09-07 |
| 6699790 | Semiconductor device fabrication method for filling high aspect ratio openings in insulators with aluminum | Byung-Hee Kim, Jong-Myeong Lee, Myoung-Bum Lee | 2004-03-02 |
| 6602782 | Methods for forming metal wiring layers and metal interconnects and metal interconnects formed thereby | Myoung-Bum Lee, Jong-Myeong Lee, Byung-Hee Kim | 2003-08-05 |
| 6590251 | Semiconductor devices having metal layers as barrier layers on upper or lower electrodes of capacitors | Sang-Bom Kang, Hyun-Seok Lim, Yung-sook Chae, In-Sang Jeon | 2003-07-08 |
| 6586340 | Wafer processing apparatus and wafer processing method using the same | Jong-Myeong Lee, Byung-Hee Kim, Myoung-Bum Lee, Ju-Young Yun | 2003-07-01 |
| 6458701 | Method for forming metal layer of semiconductor device using metal halide gas | Yun-sook Chae, Sang-Bom Kang, In-Sang Jeon | 2002-10-01 |
| 6432820 | Method of selectively depositing a metal layer in an opening in a dielectric layer by forming a metal-deposition-prevention layer around the opening of the dielectric layer | Myoung-Bum Lee, Jong-Myeong Lee, Byung-Hee Kim | 2002-08-13 |
| 6399491 | Method of manufacturing a barrier metal layer using atomic layer deposition | In-Sang Jeon, Sang-Bom Kang, Hyun-Seok Lim | 2002-06-04 |
| 6391769 | Method for forming metal interconnection in semiconductor device and interconnection structure fabricated thereby | Jong-Myeong Lee, Hyun-Seok Lim, Byung-Hee Kim, Sang In Lee | 2002-05-21 |
| 6355554 | Methods of forming filled interconnections in microelectronic devices | Eung-Joon Lee, Byeong-Jun Kim | 2002-03-12 |
| 6348376 | Method of forming metal nitride film by chemical vapor deposition and method of forming metal contact and capacitor of semiconductor device using the same | Hyun-Seok Lim, Sang-Bom Kang, In-Sang Jeon | 2002-02-19 |
| 6287965 | Method of forming metal layer using atomic layer deposition and semiconductor device having the metal layer as barrier metal layer or upper or lower electrode of capacitor | Sang-Bom Kang, Hyun-Seok Lim, Yung-sook Chae, In-Sang Jeon | 2001-09-11 |
| 5982039 | Completely buried contact holes | Woo-Sang Jung, Ji-Soon Park, Byeong-Jun Kim | 1999-11-09 |
| 5950105 | Completely buried contact holes and methods of forming same | Woo-Sang Jung, Ji-Soon Park, Byeong-Jun Kim | 1999-09-07 |