KH

Kyu-Pyung Hwang

QU Qualcomm: 29 patents #797 of 12,104Top 7%
TB The Boeing: 9 patents #1,188 of 15,756Top 8%
📍 San Diego, CA: #947 of 23,606 inventorsTop 5%
🗺 California: #12,236 of 386,348 inventorsTop 4%
Overall (All Time): #85,539 of 4,157,543Top 3%
38
Patents All Time

Issued Patents All Time

Showing 26–38 of 38 patents

Patent #TitleCo-InventorsDate
9472425 Power distribution improvement using pseudo-ESR control of an embedded passive capacitor Young Kyu Song, Jae Sik Lee 2016-10-18
9449762 Embedded package substrate capacitor with configurable/controllable equivalent series resistance Young Kyu Song, Dong Wook Kim, Xiaonan Zhang, Ryan David Lane 2016-09-20
9425143 Integrated device package comprising an electromagnetic (EM) passive device in an encapsulation layer, and an EM shield Young Kyu Song 2016-08-23
9385077 Integrated device comprising coaxial interconnect Dong Wook Kim, Young Kyu Song, Hong Bok We 2016-07-05
9355963 Semiconductor package interconnections and method of making the same Dong Wook Kim, Jae Sik Lee, Hong Bok We, Young Kyu Song, Chin-Kwan Kim +1 more 2016-05-31
9335384 Adjustable magnetic probe for efficient near field scanning Young Kyu Song, Dong Wook Kim, Changhan Hobie Yun 2016-05-10
9294064 Bandpass filter implementation on a single layer using spiral capacitors Young Kyu Song, Changhan Hobie Yun, Dong Wook Kim 2016-03-22
9275876 Stiffener with embedded passive components Dong Wook Kim, Young Kyu Song, Changhan Hobie Yun 2016-03-01
9269610 Pattern between pattern for low profile substrate Hong Bok We, Chin-Kwan Kim, Dong Wook Kim, Jae Sik Lee, Young Kyu Song 2016-02-23
9151779 Reconfigurable electric field probe Young Kyu Song, Changhan Hobie Yun, Dong Wook Kim 2015-10-06
9093295 Embedded sheet capacitor Young Kyu Song, Dong Wook Kim, Changhan Hobie Yun 2015-07-28
9041212 Thermal design and electrical routing for multiple stacked packages using through via insert (TVI) Dong Wook Kim, Victor A. Chiriac, Changhan Hobie Yun, Young Kyu Song 2015-05-26
8987872 Electromagnetic interference enclosure for radio frequency multi-chip integrated circuit packages Young Kyu Song, Dong Wook Kim, Changhan Hobie Yun 2015-03-24