Issued Patents All Time
Showing 26–50 of 56 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10074625 | Wafer level package (WLP) ball support using cavity structure | Mario Francisco Velez, Changhan Hobie Yun, Jonghae Kim, Chengjie Zuo, Daeik Daniel Kim +3 more | 2018-09-11 |
| 10069474 | Encapsulation of acoustic resonator devices | Changhan Hobie Yun, Chengjie Zuo, Daeik Daniel Kim, Mario Francisco Velez, Niranjan Sunil Mudakatte +4 more | 2018-09-04 |
| 10044390 | Glass substrate including passive-on-glass device and semiconductor die | Changhan Hobie Yun, Chengjie Zuo, Mario Francisco Velez, Niranjan Sunil Mudakatte, Shiqun Gu +1 more | 2018-08-07 |
| 10038422 | Single-chip multi-frequency film bulk acoustic-wave resonators | Changhan Hobie Yun, Je-Hsiung Lan, Chengjie Zuo, Jonghae Kim, Mario Francisco Velez +2 more | 2018-07-31 |
| 10026546 | Apparatus with 3D wirewound inductor integrated within a substrate | Changhan Hobie Yun, Chengjie Zuo, Daeik Daniel Kim, Mario Francisco Velez, Niranjan Sunil Mudakatte +1 more | 2018-07-17 |
| 9966426 | Augmented capacitor structure for high quality (Q)-factor radio frequency (RF) applications | Niranjan Sunil Mudakatte, Daeik Daniel Kim, Changhan Hobie Yun, Je-Hsiung Lan, Chengjie Zuo +3 more | 2018-05-08 |
| 9959964 | Thin film magnet inductor structure for high quality (Q)-factor radio frequency (RF) applications | Changhan Hobie Yun, Daeik Daniel Kim, Chengjie Zuo, Jonghae Kim, Je-Hsiung Lan +2 more | 2018-05-01 |
| 9954267 | Multiplexer design using a 2D passive on glass filter integrated with a 3D through glass via filter | Changhan Hobie Yun, Daeik Daniel Kim, Mario Francisco Velez, Chengjie Zuo, Jonghae Kim | 2018-04-24 |
| 9935166 | Capacitor with a dielectric between a via and a plate of the capacitor | Je-Hsiung Lan, Chengjie Zuo, Changhan Hobie Yun, Daeik Daniel Kim, Robert Paul Mikulka +2 more | 2018-04-03 |
| 9930783 | Passive device assembly for accurate ground plane control | Chengjie Zuo, Daeik Daniel Kim, Changhan Hobie Yun, Mario Francisco Velez, Jonghae Kim | 2018-03-27 |
| 9906318 | Frequency multiplexer | Chengjie Zuo, Daeik Daniel Kim, Changhan Hobie Yun, Je-Hsiung Lan, Robert Paul Mikulka +5 more | 2018-02-27 |
| 9893048 | Passive-on-glass (POG) device and method | Je-Hsiung Lan, Niranjan Sunil Mudakatte, Changhan Hobie Yun, Daeik Daniel Kim, Chengjie Zuo +2 more | 2018-02-13 |
| 9875848 | MIM capacitor and method of making the same | Daeik Daniel Kim, Niranjan Sunil Mudakatte, Je-Hsiung Lan, Chengjie Zuo, Changhan Hobie Yun +2 more | 2018-01-23 |
| 9876513 | LC filter layer stacking by layer transfer to make 3D multiplexer structures | Changhan Hobie Yun, Chengjie Zuo, Daeik Daniel Kim, Mario Francisco Velez, Niranjan Sunil Mudakatte +1 more | 2018-01-23 |
| 9813043 | Tunable diplexers in three-dimensional (3D) integrated circuits (IC) (3DIC) and related components and methods | Chengjie Zuo, Daeik Daniel Kim, Je-Hsiung Lan, Jonghae Kim, Mario Francisco Velez +5 more | 2017-11-07 |
| 9807882 | Density-optimized module-level inductor ground structure | Changhan Hobie Yun, Niranjan Sunil Mudakatte, Mario Francisco Velez, Chengjie Zuo, Jonghae Kim | 2017-10-31 |
| 9780048 | Side-assembled passive devices | Changhan Hobie Yun, Chengjie Zuo, Niranjan Sunil Mudakatte, Mario Francisco Velez, Shiqun Gu +1 more | 2017-10-03 |
| 9768109 | Integrated circuits (ICS) on a glass substrate | Shiqun Gu, Daeik Daniel Kim, Matthew Michael Nowak, Jonghae Kim, Changhan Hobie Yun +1 more | 2017-09-19 |
| 9721946 | Backside coupled symmetric varactor structure | Daeik Daniel Kim, Je-Hsiung Lan, Changhan Hobie Yun, Jonghae Kim | 2017-08-01 |
| 9666362 | Superposed structure 3D orthogonal through substrate inductor | Chengjie Zuo, Daeik Daniel Kim, Changhan Hobie Yun, Mario Francisco Velez, Robert Paul Mikulka +1 more | 2017-05-30 |
| 9660110 | Varactor device with backside contact | Daeik Daniel Kim, Jonghae Kim, Chengjie Zuo, Sang-June Park, Changhan Hobie Yun +3 more | 2017-05-23 |
| 9634640 | Tunable diplexers in three-dimensional (3D) integrated circuits (IC) (3DIC) and related components and methods | Chengjie Zuo, Daeik Daniel Kim, Je-Hsiung Lan, Jonghae Kim, Mario Francisco Velez +5 more | 2017-04-25 |
| 9620463 | Radio-frequency (RF) shielding in fan-out wafer level package (FOWLP) | Daeik Daniel Kim, Mario Francisco Velez, Changhan Hobie Yun, Chengjie Zuo, Jonghae Kim +1 more | 2017-04-11 |
| 9560745 | Devices and methods to reduce stress in an electronic device | Daeik Daniel Kim, Je-Hsiung Lan, Changhan Hobie Yun, Mario Francisco Velez, Chengjie Zuo +1 more | 2017-01-31 |
| 9502586 | Backside coupled symmetric varactor structure | Daeik Daniel Kim, Je-Hsiung Lan, Changhan Hobie Yun, Jonghae Kim | 2016-11-22 |