Issued Patents All Time
Showing 51–56 of 56 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9478348 | Vertical spiral inductor | Daeik Daniel Kim, Changhan Hobie Yun, Mario Francisco Velez, Chengjie Zuo, Jonghae Kim | 2016-10-25 |
| 9343403 | Stress mitigation structure for wafer warpage reduction | Je-Hsiung Lan, Chengjie Zuo, Daeik Daniel Kim, Changhan Hobie Yun, Mario Francisco Velez +3 more | 2016-05-17 |
| 9275786 | Superposed structure 3D orthogonal through substrate inductor | Chengjie Zuo, Daeik Daniel Kim, Changhan Hobie Yun, Mario Francisco Velez, Robert Paul Mikulka +1 more | 2016-03-01 |
| 9203373 | Diplexer design using through glass via technology | Chengjie Zuo, Jonghae Kim, Mario Francisco Velez, Je-Hsiung Lan, Daeik Daniel Kim +5 more | 2015-12-01 |
| 9202789 | Die package comprising die-to-wire connector and a wire-to-die connector configured to couple to a die package | Daeik Daniel Kim, Mario Francisco Velez, Jonghae Kim, Matthew Michael Nowak, Chengjie Zuo +2 more | 2015-12-01 |
| 9136574 | Compact 3-D coplanar transmission lines | Daeik Daniel Kim, Jonghae Kim, Chengjie Zuo, Changhan Hobie Yun, Mario Francisco Velez +2 more | 2015-09-15 |