| 10312193 |
Package comprising switches and filters |
Shiqun Gu, Steve Fanelli, Husnu Ahmet Masaracioglu |
2019-06-04 |
| 10290414 |
Substrate comprising an embedded inductor and a thin film magnetic core |
Changhan Hobie Yun, Mario Francisco Velez, Daeik Daniel Kim, David Francis Berdy, Je-Hsiung Lan +3 more |
2019-05-14 |
| 10283257 |
Skewed co-spiral inductor structure |
Daeik Daniel Kim, David Francis Berdy, Changhan Hobie Yun, Jonghae Kim |
2019-05-07 |
| 10256863 |
Monolithic integration of antenna switch and diplexer |
Shiqun Gu, Steve Fanelli, Thomas A. Gee, Young Kyu Song |
2019-04-09 |
| 10249580 |
Stacked substrate inductor |
Daeik Daniel Kim, Changhan Hobie Yun, David Francis Berdy, Mario Francisco Velez, Jonghae Kim |
2019-04-02 |
| 10242957 |
Compartment shielding in flip-chip (FC) module |
Daeik Daniel Kim, Changhan Hobie Yun, Mario Francisco Velez, David Francis Berdy, Jonghae Kim +1 more |
2019-03-26 |
| 10187031 |
Tunable matching network |
Yunfei Ma, David Francis Berdy, Daeik Daniel Kim, Changhan Hobie Yun, Je-Hsiung Lan +4 more |
2019-01-22 |
| 10171112 |
RF multiplexer with integrated directional couplers |
Yunfei Ma, David Francis Berdy, Daeik Daniel Kim, Changhan Hobie Yun, Je-Hsiung Lan +4 more |
2019-01-01 |
| 10163771 |
Interposer device including at least one transistor and at least one through-substrate via |
Changhan Hobie Yun, David Francis Berdy, Niranjan Sunil Mudakatte, Mario Francisco Velez, Shiqun Gu +1 more |
2018-12-25 |
| 10154591 |
Passive device assembly for accurate ground plane control |
David Francis Berdy, Daeik Daniel Kim, Changhan Hobie Yun, Mario Francisco Velez, Jonghae Kim |
2018-12-11 |
| 10141908 |
Multi-density MIM capacitor for improved passive on glass (POG) multiplexer performance |
Niranjan Sunil Mudakatte, David Francis Berdy, Changhan Hobie Yun, Shiqun Gu, Mario Francisco Velez +1 more |
2018-11-27 |
| 10141353 |
Passive components implemented on a plurality of stacked insulators |
Changhan Hobie Yun, Daeik Daniel Kim, Jonghae Kim, Mario Francisco Velez, David Francis Berdy |
2018-11-27 |
| 10103135 |
Backside ground plane for integrated circuit |
Jonghae Kim, David Francis Berdy, Changhan Hobie Yun, Niranjan Sunil Mudakatte, Mario Francisco Velez +1 more |
2018-10-16 |
| 10103116 |
Open-passivation ball grid array pads |
Daeik Daniel Kim, Mario Francisco Velez, Changhan Hobie Yun, David Francis Berdy, Jonghae Kim +1 more |
2018-10-16 |
| 10103703 |
Double-sided circuit |
Changhan Hobie Yun, David Francis Berdy, Daeik Daniel Kim, Jonghae Kim, Mario Francisco Velez +2 more |
2018-10-16 |
| 10074625 |
Wafer level package (WLP) ball support using cavity structure |
Mario Francisco Velez, David Francis Berdy, Changhan Hobie Yun, Jonghae Kim, Daeik Daniel Kim +3 more |
2018-09-11 |
| 10069474 |
Encapsulation of acoustic resonator devices |
Changhan Hobie Yun, Daeik Daniel Kim, Mario Francisco Velez, Niranjan Sunil Mudakatte, Je-Hsiung Lan +4 more |
2018-09-04 |
| 10049815 |
Nested through glass via transformer |
Daeik Daniel Kim, Jonghae Kim, Mario Francisco Velez, Changhan Hobie Yun |
2018-08-14 |
| 10044390 |
Glass substrate including passive-on-glass device and semiconductor die |
Changhan Hobie Yun, Mario Francisco Velez, Niranjan Sunil Mudakatte, Shiqun Gu, Jonghae Kim +1 more |
2018-08-07 |
| 10039188 |
Two-stage power delivery architecture |
Changhan Hobie Yun, Francesco Carobolante, Jonghae Kim, Mario Francisco Velez, Lawrence D. Smith +1 more |
2018-07-31 |
| 10038422 |
Single-chip multi-frequency film bulk acoustic-wave resonators |
Changhan Hobie Yun, Je-Hsiung Lan, David Francis Berdy, Jonghae Kim, Mario Francisco Velez +2 more |
2018-07-31 |
| 10026546 |
Apparatus with 3D wirewound inductor integrated within a substrate |
Changhan Hobie Yun, Daeik Daniel Kim, Mario Francisco Velez, Niranjan Sunil Mudakatte, Jonghae Kim +1 more |
2018-07-17 |
| 9966426 |
Augmented capacitor structure for high quality (Q)-factor radio frequency (RF) applications |
Niranjan Sunil Mudakatte, Daeik Daniel Kim, David Francis Berdy, Changhan Hobie Yun, Je-Hsiung Lan +3 more |
2018-05-08 |
| 9959964 |
Thin film magnet inductor structure for high quality (Q)-factor radio frequency (RF) applications |
Changhan Hobie Yun, David Francis Berdy, Daeik Daniel Kim, Jonghae Kim, Je-Hsiung Lan +2 more |
2018-05-01 |
| 9954267 |
Multiplexer design using a 2D passive on glass filter integrated with a 3D through glass via filter |
Changhan Hobie Yun, Daeik Daniel Kim, Mario Francisco Velez, David Francis Berdy, Jonghae Kim |
2018-04-24 |