Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8710859 | Method for testing multi-chip stacked packages | — | 2014-04-29 |
| 8703508 | Method for wafer-level testing diced multi-chip stacked packages | Yu-Shin Liu, Shin-Kung CHEN, Kun-Chih Chan | 2014-04-22 |