Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8703508 | Method for wafer-level testing diced multi-chip stacked packages | Kai-Jun Chang, Shin-Kung CHEN, Kun-Chih Chan | 2014-04-22 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8703508 | Method for wafer-level testing diced multi-chip stacked packages | Kai-Jun Chang, Shin-Kung CHEN, Kun-Chih Chan | 2014-04-22 |