Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9250288 | Wafer-level testing method for singulated 3D-stacked chip cubes | Shin-Kung CHEN, Sheng-Chi Lin | 2016-02-02 |
| 8703508 | Method for wafer-level testing diced multi-chip stacked packages | Kai-Jun Chang, Yu-Shin Liu, Shin-Kung CHEN | 2014-04-22 |