Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11693043 | Test head assembly for semiconductor device | Ying-Tang Chao, Yen-Yu Chen | 2023-07-04 |
| 11608205 | Head of a tag device | Ching-Chia Yang, Yuan-Jung LU, Yen-Yu Chen, Hsing-Fu PENG, Pao-Chen Lin | 2023-03-21 |
| 9250288 | Wafer-level testing method for singulated 3D-stacked chip cubes | Kun-Chih Chan, Sheng-Chi Lin | 2016-02-02 |
| 8703508 | Method for wafer-level testing diced multi-chip stacked packages | Kai-Jun Chang, Yu-Shin Liu, Kun-Chih Chan | 2014-04-22 |