Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Integrated circuit package, and methods and tools for fabricating the same

Integrated circuit package, and methods and tools for fabricating the same

US Patent 9947560 · Granted Apr 17, 2018

Estimated economic value: $81,271,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Electronic device with below PCB thermal management2025
Frame for coupling of a thermal management device to a printed circuit board2025
Heat spreader for a semiconductor package2025
3D object detection using random forests2025
Semiconductor chip with redundant thru-silicon-vias2024
Micro device with adaptable thermal management device2024
Heterogeneous integration module comprising thermal management apparatus2023
Radome with integrated passive cooling2023
Thermal enablement of dies with impurity gettering2022
Stacked silicon package assembly having vertical thermal management2022
Remote active cooling heat exchanger and antenna system with the same2022
Remote active cooling heat exchanger and antenna system with the same2022