Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Metrology methods to detect plasma in wafer cavity and use of the metrology for station-to-station and tool-to-tool matching

Metrology methods to detect plasma in wafer cavity and use of the metrology for station-to-station and tool-to-tool matching

US Patent 9875883 · Granted Jan 23, 2018

Estimated economic value: $37,230,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Multiple-output radiofrequency matching module and associated methods2025
Capacitance measurement without disconnecting from high power circuit2025
Detection and location of anomalous plasma events in fabrication chambers2025
Anomalous plasma event detection and mitigation in semiconductor processing2025
Anomalous plasma event detection and mitigation in semiconductor processing2025
Mechanical suppression of parasitic plasma in substrate processing chamber2025
Mechanical suppression of parasitic plasma in substrate processing chamber2025
Radio frequency power generator having multiple output ports2025
Early warning systems and methods for determining capacitor failures2024
Combiner and distributor for adjusting impedances or power across multiple plasm2024
Combiner and distributor for adjusting impedances or power across multiple plasm2024
Combiner and distributor for adjusting impedances or power across multiple plasm2024