Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Embedded package and method thereof

Embedded package and method thereof

US Patent 9685430 · Granted Jun 20, 2017

Estimated economic value: $1,009,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Antenna and communication device2025
Technologies for isolated heat dissipating devices2025
Intelligent power module containing exposed surfaces of transistor die supportin2025
Chip scale package (CSP) semiconductor device having thin substrate2025
Power semiconductor module2024
Power semiconductor module2024
Power converter for high power density applications2024
Semiconductor package having thin substrate and method of making the same2023
Power converter for high power density2023
DMOS FET chip scale package and method of making the same2023
DMOS FET chip scale package and method of making the same2023
Semiconductor package having thin substrate and method of making the same2022