Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Sawing underfill in packaging processes

Sawing underfill in packaging processes

US Patent 9620430 · Granted Apr 11, 2017

Estimated economic value: $2,677,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Method of singulating a semiconductor device2025
Package assembly including a package lid having a step region and method of maki2025
Connecting structure, package structure and manufacturing method thereof2025
Integrated circuit structure, and method for forming thereof2025
Semiconductor package and method2025
Package structures2025
Integrated circuit package and method2025
Semiconductor device having underfill surrounding bottom package and solder ball2025
Integrated circuit package and method of forming same2025
Semiconductor package and manufacturing method thereof2025
Integrated circuit package and method2025
Through-substrate vias with improved connections2025