{"@context": "https://schema.org", "@type": "BreadcrumbList", "itemListElement": [{"@type": "ListItem", "position": 1, "name": "Home", "item": "https://www.patentleaderboard.com/"}, {"@type": "ListItem", "position": 2, "name": "Single-package phased array module with interleaved sub-arrays", "item": "https://www.patentleaderboard.com/patent/9413079"}]}
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Home › Single-package phased array module with interleaved sub-arrays

Single-package phased array module with interleaved sub-arrays

US Patent 9413079 · Granted Aug 9, 2016

Estimated economic value: $12,367,000 ⓘ

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