Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Exposed pad integrated circuit package with mold lock

Exposed pad integrated circuit package with mold lock

US Patent 9362211 · Granted Jun 7, 2016

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Method for target detection based on correlation analysis of spatial phase in an2025
Semiconductor device package having thermal dissipation feature and method there2025
Semiconductor device with cavity carrier and method therefor2025
Surface-mount amplifier devices2024
Semiconductor device packaging warpage control2024
Radio frequency packages containing multilevel power substrates and associated f2024
Tie bar removal for semiconductor device packaging2024
Semiconductor package thermal spreader having integrated EF/EMI shielding and an2024
Intelligent device and method for controlling boot screen of the intelligent dev2023
Semiconductor device package having thermal dissipation feature and method there2023
Semiconductor device packaging warpage control2023
Integrated circuit package and method to manufacture the integrated circuit pack2023