{"@context": "https://schema.org", "@type": "BreadcrumbList", "itemListElement": [{"@type": "ListItem", "position": 1, "name": "Home", "item": "https://www.patentleaderboard.com/"}, {"@type": "ListItem", "position": 2, "name": "Interconnect structure and method of making same", "item": "https://www.patentleaderboard.com/patent/9334572"}]}
Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Interconnect structure and method of making same

Interconnect structure and method of making same

US Patent 9334572 · Granted May 10, 2016

Estimated economic value: $1,020,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Magnetoresistive random-access memory (MRAM) with preserved underlying dielectri2025
Rework for metal interconnects using etch and thermal anneal2024
Contacts having a geometry to reduce resistance2024
Interconnect structures including self aligned vias2023
Multiple patterning with mandrel cuts defined by block masks2022
Metal on metal multiple patterning2022
Interconnect integration scheme with fully self-aligned vias2022
Double patterning interconnect integration scheme with SAV2022
Interconnect structures including self aligned vias2022
Semiconductor via structure with lower electrical resistance2021
Contacts having a geometry to reduce resistance2021
Self aligned via and pillar cut for at least a self aligned double pitch2021