{"@context": "https://schema.org", "@type": "BreadcrumbList", "itemListElement": [{"@type": "ListItem", "position": 1, "name": "Home", "item": "https://www.patentleaderboard.com/"}, {"@type": "ListItem", "position": 2, "name": "Wafer debonding using long-wavelength infrared radiation ablation", "item": "https://www.patentleaderboard.com/patent/9269561"}]}
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Home › Wafer debonding using long-wavelength infrared radiation ablation

Wafer debonding using long-wavelength infrared radiation ablation

US Patent 9269561 · Granted Feb 23, 2016

Estimated economic value: $655,000 ⓘ

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