Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Using a double-cut for mechanical protection of a wafer-level chip scale package (WLCSP)

Using a double-cut for mechanical protection of a wafer-level chip scale package (WLCSP)

US Patent 9245804 · Granted Jan 26, 2016

Estimated economic value: $38,871,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Seal arrangement2022
Dual-interface IC card module2022
Seal arrangement2021
Semiconductor device and method of making a semiconductor device2021
Semiconductor device and method of making a semiconductor device2021
Semiconductor device and method of making a semiconductor device2021
Integrated circuit saw bow break point2021
Dual-interface IC card module2019
Semiconductor device with six-sided protected walls2019
Dual-interface IC card2019
Variable stealth laser dicing process2019
Variable stealth laser dicing process2019