Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Semiconductor die package with pre-molded die

Semiconductor die package with pre-molded die

US Patent 9214413 · Granted Dec 15, 2015

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Device for storing and dispensing at least two cosmetic products and related met2025
Resonant converter2025
Magnetic recording head with current path between trailing shield and leading sh2025
Magnetic recording head with a cross-track current flow in a low resistance path2025
Display panel, display panel driving method and display device2025
Matrix-vector multiplication using SOT-based non-volatile memory cells2025
Magnetic recording head with assisting electric current in trailing shield2025
Road side vehicle occupancy detection system2025
Magnetic recording devices having external alternating current sources2025
Display module and driving method thereof, and display device2025
Dual FGL and dual SPL spintronic device to reduce perpendicular field at writing2025
Spintronic device comprising dual FGL and dual SPL to reduce perpendicular field2025