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Home › Integrated circuits including epitaxially grown strain-inducing fills doped with boron for improved robustness from delimination and methods for fabricating the same

Integrated circuits including epitaxially grown strain-inducing fills doped with boron for improved robustness from delimination and methods for fabricating the same

US Patent 9064961 · Granted Jun 23, 2015

Estimated economic value: $1,346,000 ⓘ

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