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Home › Semiconductor package having light-emitting-diode solder-bonded on first and second conductive pads separated by at least 75 UM

Semiconductor package having light-emitting-diode solder-bonded on first and second conductive pads separated by at least 75 UM

US Patent 8970053 · Granted Mar 3, 2015

Estimated economic value: $1,508,000 ⓘ

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