{"@context": "https://schema.org", "@type": "BreadcrumbList", "itemListElement": [{"@type": "ListItem", "position": 1, "name": "Home", "item": "https://www.patentleaderboard.com/"}, {"@type": "ListItem", "position": 2, "name": "Electronic package and method of fabricating the same", "item": "https://www.patentleaderboard.com/patent/9818683"}]}
Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Electronic package and method of fabricating the same

Electronic package and method of fabricating the same

US Patent 9818683 · Granted Nov 14, 2017

Estimated economic value: $408,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Antenna-in-package construction with frequency division duplex technology2025
Manufacturing method for semiconductor structure having a plurality of fins2025
Method of fabricating a FinFET device2024
Semiconductor structure having fin with all around gate2024
Semiconductor arrangement with fin features having different heights2022
Semiconductor structure having field plate and associated fabricating method2021
Method for forming interconnect structure2021
FinFET device2021
Capacitor embedded with nanocrystals2021
Structure of integrated radio frequency multi-chip package and method of fabrica2021
Methods for forming a semiconductor arrangement of fins having multiple heights 2020
Wireless receiving device2020