{"@context": "https://schema.org", "@type": "BreadcrumbList", "itemListElement": [{"@type": "ListItem", "position": 1, "name": "Home", "item": "https://www.patentleaderboard.com/"}, {"@type": "ListItem", "position": 2, "name": "Electronic package having circuit structure with plurality of metal layers, and fabrication method thereof", "item": "https://www.patentleaderboard.com/patent/9875949"}]}

Home › Electronic package having circuit structure with plurality of metal layers, and fabrication method thereof

Electronic package having circuit structure with plurality of metal layers, and fabrication method thereof

US Patent 9875949 · Granted Jan 23, 2018

Estimated economic value: $285,000 ⓘ

Assignee

Siliconware Precision Industries Co.

Inventors

Hsiao-Chun Huang (10 patents)
Hsien-Wen Chen (13 patents)
Shih-Ching Chen (35 patents)
Guang-Hwa Ma (25 patents)

View full patent text on Google Patents →