Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Apparatus for thermal-slide debonding of temporary bonded semiconductor wafers

Apparatus for thermal-slide debonding of temporary bonded semiconductor wafers

US Patent 8919412 · Granted Dec 30, 2014

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Apparatus, system, and method for handling aligned wafer pairs2023
Apparatus, system, and method for handling aligned wafer pairs2023
System and related techniques for handling aligned substrate pairs2021
System and related techniques for handling aligned substrate pairs2021
Baking device for a wafer coated with a coating containing a solvent2020
Apparatus, system, and method for handling aligned wafer pairs2020
Apparatus, system, and method for handling aligned wafer pairs2020
Apparatus and method for semiconductor wafer leveling, force balancing and conta2020
Apparatus and method for semiconductor wafer leveling, force balancing and conta2020
Semiconductor bonding apparatus and related techniques2019
Semiconductor bonding apparatus and related techniques2019
Automated creation of join graphs for unrelated data sets among relational datab2018