Electrical bypass structure for MEMS device

Assignee

• TSMC

Inventors

• Chia-Ming Hung (37 patents)
• Hung-Sen Wang (11 patents)
• Hsiang-Fu Chen (40 patents)
• Te-Hsi Lee (11 patents)
• Alex Kalnitsky (27 patents)
• Wen-Chuan Tai (49 patents)
• Kuei-Sung Chang (87 patents)
• Yi Heng Tsai (36 patents)

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