Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Stacked inverted flip chip package and fabrication method

Stacked inverted flip chip package and fabrication method

US Patent 8836115 · Granted Sep 16, 2014

Estimated economic value: $16,055,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Semiconductor devices and methods of manufacturing semiconductor devices2025
Semiconductor package with front side and back side redistribution structures an2024
Carrier assisted substrate method of manufacturing an electronic device and elec2024
Stackable package and method2024
Semiconductor devices and methods of manufacturing semiconductor devices2024
Semiconductor package with front side and back side redistribution structures an2023
Thin bonded interposer package2023
Methods and structures for increasing the allowable die size in TMV packages2022
Semiconductor devices and methods of manufacturing semiconductor devices2022
Carrier assisted substrate method of manufacturing an electronic device and elec2021
Semiconductor package and fabricating method thereof2021
Thin bonded interposer package2020