Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Semiconductor package with front side and back side redistribution structures and fabricating method thereof

Semiconductor package with front side and back side redistribution structures and fabricating method thereof

US Patent 11652038 · Granted May 16, 2023

Estimated economic value: $46,712,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Secure permissioning of access to user accounts, including secure deauthorizatio2025
Photonic glass layer substrate with embedded optical structures for communicatin2025
Method for collective dishing of singulated dies2025
Semiconductor package with routing patch and method of fabricating the semicondu2025
Semiconductor package with routing patch and method of fabricating the semicondu2025
Semiconductor package with routing patch and method of fabricating the semicondu2025
Semiconductor devices and methods of manufacturing semiconductor devices2025
Methods for fabrication of optical structures on photonic glass layer substrates2025
Semiconductor device with tiered pillar and manufacturing method thereof2024
Semiconductor device with tiered pillar and manufacturing method thereof2024
Semiconductor package with front side and back side redistribution structures an2024
Semiconductor package with front side and back side redistribution structures an2024