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Home › Method of forming an integrated circuit package including a direct connect pad, a blind via, and a bond pad electrically coupled to the direct connect pad

Method of forming an integrated circuit package including a direct connect pad, a blind via, and a bond pad electrically coupled to the direct connect pad

US Patent 8828799 · Granted Sep 9, 2014

Estimated economic value: $5,271,000 ⓘ

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