Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Reducing substrate warpage in semiconductor processing

Reducing substrate warpage in semiconductor processing

US Patent 8691706 · Granted Apr 8, 2014

Estimated economic value: $4,243,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Stacked image sensor device and method of forming same2025
Method of manufacturing semiconductor devices with system on chip devices2025
Semiconductor device and manufacturing method thereof2025
Structure having thermal dissipation structure therein and manufacturing method 2025
Thermo-electric cooler for dissipating heat of optical engine2025
Integrated circuit package and method2025
Integrated circuit package and method2025
Semiconductor device having underfill surrounding bottom package and solder ball2025
Apparatus, system and method2025
Chip stack structure with conductive plug and method for forming the same2025
3D integrated circuit (3DIC) structure2025
3D integrated circuit (3DIC) structure2025