Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Preventing UBM oxidation in bump formation processes

Preventing UBM oxidation in bump formation processes

US Patent 8609526 · Granted Dec 17, 2013

Estimated economic value: $2,917,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Semiconductor structure, stacked structure with terminal comprising capping laye2025
Semiconductor packages and method of manufacturing the same2025
Package structure2025
3D integrated circuit (3DIC) structure2025
Integrated circuit package and method2025
Dielectric slots underneath conductive vias in interconnect structure of semicon2025
Integrated circuit package and method2025
Stacked memory cube with integrated thermal path for enhanced heat dissipation2025
Fingerprint sensor device and method2025
Semiconductor package and method2025
Semiconductor package system and method2025
Semiconductor package and manufacturing method thereof2025