Stacked dual chip package and method of fabrication

Assignee

• Alpha And Omega Semiconductor

Inventors

• Hamza Yilmaz (266 patents)
• Xiaotian Zhang (51 patents)
• Yan Xun Xue (140 patents)
• Anup Bhalla (301 patents)
• Jun Lu (105 patents)
• Kai Liu (137 patents)
• Yueh-Se Ho (110 patents)
• John Amato (17 patents)

View full patent text on Google Patents →