Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method of producing a chip package, and chip package

Method of producing a chip package, and chip package

US Patent 8563358 · Granted Oct 22, 2013

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Microelectronic arrangement and method for manufacturing the same2024
3D flex-foil package2023
Thin dual foil package including multiple foil substrates2023
Multi-layer 3D foil package2023
Flex-foil package with coplanar topology for high-frequency signals2022
Method for manufacturing planar thin packages2020
Device comprising film for electrostatic coupling of a substrate to a substrate 2019
Carrier wafer, method for holding a flexible substrate and method for the manufa2018
Method for producing flexible integrated circuits which may be provided contiguo2012
Method and device for electrostatic fixing of substrates with polarized molecule2010
Mobile holder for a wafer2006
Method of subdividing a wafer2004