Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11764122 | 3D flex-foil package | — | 2023-09-19 |
| 11615996 | Thin dual foil package including multiple foil substrates | — | 2023-03-28 |
| 11521919 | Flex-foil package with coplanar topology for high-frequency signals | — | 2022-12-06 |
| 8563358 | Method of producing a chip package, and chip package | Christof Landesberger | 2013-10-22 |