Issued Patents All Time
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11901285 | Microelectronic arrangement and method for manufacturing the same | Christoph Kutter, Peter Ramm | 2024-02-13 |
| 11570898 | Multi-layer 3D foil package | Erwin Yacoub-George, Martin König | 2023-01-31 |
| 10752499 | Method for manufacturing planar thin packages | Indranil Bose | 2020-08-25 |
| 10304714 | Device comprising film for electrostatic coupling of a substrate to a substrate carrier | — | 2019-05-28 |
| 9978626 | Carrier wafer, method for holding a flexible substrate and method for the manufacture of a carrier wafer | Christoph Kutter, Dieter Bollmann | 2018-05-22 |
| 8563358 | Method of producing a chip package, and chip package | Robert Faul | 2013-10-22 |
| 8198135 | Method for producing flexible integrated circuits which may be provided contiguously | Gerhard Klink, Michael Feil | 2012-06-12 |
| 7733624 | Method and device for electrostatic fixing of substrates with polarized molecules | — | 2010-06-08 |
| 7027283 | Mobile holder for a wafer | Armin Klumpp, Martin Bleier | 2006-04-11 |
| 6756288 | Method of subdividing a wafer | Michael Feil, Armin Klumpp, Erwin Hacker | 2004-06-29 |
| 6514790 | Method for handling a plurality of circuit chips | Andreas Plettner, Karl Haberger | 2003-02-04 |
| 6444493 | Method for vertically integrating active circuit planes and vertically integrated circuit produced using said method | Michael Feil | 2002-09-03 |
| 6328841 | Process for joining inorganic substrates in a permanent manner | Armin Klumpp | 2001-12-11 |