Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Thin dual foil package including multiple foil substrates

Thin dual foil package including multiple foil substrates

US Patent 11615996 · Granted Mar 28, 2023

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

3D flex-foil package2023
Flex-foil package with coplanar topology for high-frequency signals2022
Method of producing a chip package, and chip package2013