Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Multi-layer 3D foil package

Multi-layer 3D foil package

US Patent 11570898 · Granted Jan 31, 2023

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Microelectronic arrangement and method for manufacturing the same2024
Motor assembly with a separating can2023
Foil-based package with distance compensation2023
Electric motor2021
Electric motor2021
Electric motor2021
Method for manufacturing planar thin packages2020
Device comprising film for electrostatic coupling of a substrate to a substrate 2019
Carrier wafer, method for holding a flexible substrate and method for the manufa2018
Method for the elimination of leukocytes from blood2018
Method of producing a chip package, and chip package2013
Method for the elimination of leukocytes from blood2013