Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Thin flip chip package structure

Thin flip chip package structure

US Patent 8471372 · Granted Jun 25, 2013

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Semiconductor structure and method of manufacturing the same2025
Semiconductor package2025
Layout structure of a flexible circuit board2023
Flexible circuit board2023
Flip chip package and circuit board thereof2023
Flip chip interconnection and circuit board thereof2022
Layout structure of a flexible circuit board2022
Circuit board2021
Chip package and circuit board thereof2021
Chip package and chip thereof2020
Chip on film package and flexible substrate thereof2020
Semiconductor package and circuit substrate thereof2019